2 Inch 100um Thickness DSP 0.1mm Sapphire Substrate(Wafer)

Size: 2 inch DSP-430-C -axis

Material: KY Sapphire Al2O3 single crystal without bubble

• Orientation:C-cut,M-axis off 0.0+/-0.2°
  
  

• Diameter: 50.8 +/-0.2mm ；

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• Thickness:100 ± 15 um ；

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• Flatness:16.0 +/- 1.0 mm 

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• Orientation: a-axis

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• Surface: SSP /dsp Epi-ready Polished ；

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• TTV<= 10um
  

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• BOW<= 20um ； 

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• Warp<= 20 um ；

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• Front Surface Roughness: (Ra) Ra <= 0.3 nm ； or double side

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• Back Surface Roughness: (Ra) Ra <0.3nm

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• Edge: from 1mm