Sapphire Substrates & Wafers

Custom Sapphire Substrates & Wafers

Precision sapphire wafers and substrates with configurable orientation, surface finish, thickness and flatness requirements.

Microwork supplies custom sapphire substrates and wafers for optical, microelectronic, semiconductor, GaN growth, infrared detector, hybrid microelectronics, polishing carrier and high-temperature applications.

Sapphire substrates are commonly selected when ultraviolet to near-infrared transmission, high thermal stability, mechanical hardness, chemical resistance or radiation resistance are required. Compared with conventional glass substrates, sapphire can provide better durability and higher operating temperature capability, but crystal orientation, surface condition, thickness, TTV, bow and warp must be reviewed carefully for engineering applications.

Available options may include C-plane, A-plane, R-plane and M-plane sapphire wafers, as well as C-axis offcut wafers toward A-axis or M-axis. SSP and DSP surface conditions, standard wafer diameters and custom substrate sizes can be reviewed based on drawing and application requirements.

Typical Applications：

Common applications include:

• Microelectronic IC applications
• SOS, Silicon-on-Sapphire
• GaN growth and superconducting compound growth
• Infrared detectors
• Hybrid microelectronics
• Polishing carriers
• Optical transmission from UV to near-IR
• High-temperature environments
• Radiation-resistant applications
• Harsh or corrosive environments

Typical Specifications

Material: Single-crystal sapphire / Al2O3
Orientation: C-plane, A-plane, R-plane, M-plane or customized orientation
Offcut: C-axis with 0.5°–10° offcut toward A-axis or M-axis, upon requirement
Surface finish: SSP or DSP
Thickness: Standard and custom thicknesses available
Thickness tolerance: Typically ±15 µm, depending on size and requirement
TTV: <10 µm, depending on wafer size and specification
Bow: <10 µm, depending on wafer size and specification
Warp: <10 µm, depending on wafer size and specification
Shape: Round wafers, square substrates or custom shapes
Packaging: Clean handling and vacuum packaging available upon requirement
Customization: Custom size, thickness, orientation and surface finish available

Standard and Custom Sizes：

Standard wafer options may include:

• 2 inch C-plane sapphire wafer, SSP or DSP
• 3 inch C-plane sapphire wafer, SSP or DSP
• 4 inch C-plane sapphire wafer, SSP or DSP
• 6 inch C-plane sapphire wafer, SSP or DSP

Custom substrate options may include:

• 10 × 10 × 0.5 mm sapphire substrates
• 20 × 20 × 0.5 mm sapphire substrates
• Ultra-thin sapphire wafers, subject to drawing review
• Custom rectangular, square or round sapphire substrates
• Other sizes and thicknesses available upon requirement

Orientation Options：

Orientation options may include:

• C-plane sapphire wafers
• A-plane (11-20) sapphire wafers
• R-plane (1-102) sapphire wafers
• M-plane (10-10) sapphire wafers
• C-axis offcut wafers toward A-axis or M-axis
• Other customized orientation requirements upon review

Engineering Considerations

When specifying a sapphire substrate or wafer, engineers should consider crystal orientation, offcut angle, wafer diameter, thickness, thickness tolerance, TTV, bow, warp, surface finish, edge condition, cleanliness and packaging method.

C-plane sapphire is widely used for optical transmission, GaN growth and substrate applications, while A-plane, R-plane and M-plane orientations may be selected for specific optical, mechanical or crystal-growth requirements. SSP and DSP surfaces should be selected according to bonding, growth, optical or handling requirements.

Thin wafers, tight TTV, low bow or warp, special offcut angles, double-side polishing and high cleanliness packaging can all affect manufacturability, lead time and cost. For early-stage projects, please provide the required orientation, diameter or shape, thickness, SSP/DSP requirement, TTV, bow, warp and packaging requirement.

Need a Custom Sapphire Substrate or Wafer?

Send us your drawing or wafer specification, including orientation, diameter, thickness, SSP/DSP surface requirement, TTV, bow, warp, offcut angle and packaging requirement. We can help review manufacturability and suitable sapphire substrate options before quotation.